The 48th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 48th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2015 will feature 5-6 technical tracks that span the two and a half days of sessions on: INTERPOSERS & 2.5/3D PACKAGING; THE FUTURE OF PACKAGING; ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY; MATERIALS & PROCESSES; MODELING, DESIGN, & TEST; and SPECIAL SESSIONS ON SYSTEM-INTEGRATION, POWER & HIGH-RELIABILITY, as well as an Interactive Student Poster Session.
The Annual IMAPS Symposium attracts approximately 1,200 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.
Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 21 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops and conferences and professional development courses that enable these professionals to enhance their careers. In addition, the Microelectronics Foundation provides annual grants to students involved in electronic packaging disciplines.