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Overview
The Wafer-Level Packaging Symposium will bring together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies.
Why Attend – 2023
The conference comprises three parallel technical tracks with two full days of presentations on Wafer-Level Packaging, 3D Integration, and Advanced Manufacturing & Test. Professional Development Courses, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 60+ exhibitors showcase their latest technologies and products.
In addition, the conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATs, as well as key technology, equipment, and materials suppliers in the exhibit area.
Why Exhibit – 2023
The conference will feature attendees from over 16 countries in the heart of Silicon Valley to immerse themselves in the latest technology and business trends. By exhibiting at the conference, exhibitors will be able to reach a focused international audience, share new products and concepts to the market, enhance relationships with existing customers and generate new leads.
Organizer
In 1984 the Surface Mount Technology Association (SMTA) was formed in California by an enthusiastic group of electronics industry colleagues. As a non-profit professional organization, SMTA is dedicated to the advancement of the electronics manufacturing industry.
SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations.
Source: Event Website
Source : Event Website
Attendees
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